With the expanding use of smaller quad flat packs and expensive ball grid arrays in today's advanced circuit designs, the importance of having a moisture sensitive control program for non-hermetic plastic encapsulated surface mount components is clear. Such components that are processed without the protection of a moisture sensitive control program can be destroyed during solder reflow processing or, even worse, have their mean time between failure (MTBF) shortened such that the part can suddenly and without notice fail in the field. It is one of the most important processes that an electronics manufacturer can implement, especially where products used in high reliability and mission critical applications such as medical, aerospace and defense are concerned. 

  • Engineering Review Board (ERB) evaluation of all sensitive components
  • Special handling and processing procedures for MSL level 5 and 6 parts
  • Controlled temperature and humidity throughout all production areas
  • Temperature & humidity data loggers for real-time environmental monitoring
  • Vacuum sealers for the elimination of moisture exposure at dry-pack
  • Temperature & humidity controlled bake ovens to control part floor life
  • Dessicator cabinets for production control of sensitive components
  • Custom part labels with MSL information for continuous identification
  • Elapsed time between MBB opening and part reflow captured

Our Moisture Sensitive Level Control Program was designed to fully eliminate any occurrence of moisture damage that can occur to advanced non-hermetic plastic encapsulated surface mount component packages during the solder reflow process. Depending upon the moisture sensitivity level (MSL) of the device, moisture can be absorbed by the hygroscopic plastic body of the component through the diffusion process if exposed to certain levels of temperature and humidity for a length of time. This moisture can be quickly released from the plastic body during exposure to the elevated temperatures found in the solder reflow process (especially those required for lead-free processes), which can result in cracking and delamination of critical interfaces within the component itself.

Based upon industry standards J-STD-020 and J-STD-033, our moisture sensitive level control program covers all Moisture Sensitive Levels (MSL 1, 2a-5a and 6) to ensure that every component is covered. Moisture sensitive components on each bill of materials are identified during the Engineering Review Board evaluation process, which results in the development of special processes covering the handling, processing and storage process for each component. Of course, all employees who are responsible for handling electronic components in any way are fully trained in the best practices of moisture sensitive control through our internal training program prior to deployment.

As the information indicated here is a summarization only, please contact us during normal business hours for a more detailed description of any area of our moisture sensitive level control program.