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Technical Manufacturing Corporation maintains a modern state of
the art facility that is fully equipped with automatic and
semi-automatic production equipment and staffed with trained and experienced personnel to handle all of
your most advanced single or double-sided plated through hole and surface mount technology printed
circuit board (PCB) or metal core (MCPCB) printed circuit board assembly requirements.
| SPECIFICATION |
CAPABILITY |
| STYLES |
RIGID,
FLEX & RIGID-FLEX |
| CONFIGURATIONS |
SINGLE AND DOUBLE
SIDED |
| TECHNOLOGIES |
SURFACE
MOUNT, THOUGH HOLE AND MIXED |
| PRODUCTION
CLASS |
IPC J-STD-001 CLASS 2, 3
& SPACE ADDENDUM |
|
INSPECTION CLASS |
IPC-A-610 CLASS 2 & 3 |
| PROTOTYPE VOLUMES |
1 PIECE MINIMUM |
| PRODUCTION
VOLUMES |
100-5000
PCS TYPICAL |
| EXPEDITED LEAD
TIMES |
1, 2, 3 AND 4 WEEKS
AVAILABLE |
| STANDARD
LEAD TIMES |
6
TO 8 WEEKS TYPICAL |
| STANDARD SUBSTRATES |
FR4, FR406, FR408,
IS410, 370HR, NELCO & ROGERS |
| METAL CORE
SUBSTRATES |
BERGQUIST,
THERMAGON, ARLON & DENKA |
| SPECIAL
SUBSTRATES |
CERAMIC,
POLYIMIDE, TEFLON & ALUMINUM |
| OUTSIDE
DIMENSIONS |
18"
BY 26" MAXIMUM |
| FABRICATION LAYERS |
32 LAYERS MAXIMUM |
| FINISHED
THICKNESS |
0.010"
TO 0.200" |
| COPPER WEIGHT |
0.25 TO 200 OZ |
| TRACE/SPACE
WIDTH |
2/2
MILS MINIMUM |
| ELECTRICAL
ATTRIBUTES |
CONTROLLED
DIELECTRIC & IMPEDANCE |
| PHYSICAL
ATTRIBUTES |
PLATED
SLOTS & FINGERS, BORES, SINKS & HOLES |
| ADVANCED ATTRIBUTES |
BLIND, BURIED
& STACKED,
MICRO & VIA-IN-PAD |
| SURFACE
FINISHES |
BARE,
HASL,
OSP, TIN, NICKEL, SILVER & GOLD |
| SOLDER MASKS |
GRN, BLK, BLU, RED,
WHT, CLEAR & CUSTOM |
| PACKAGE
SIZES |
0201
MINIMUM |
| SPECIAL PACKAGES |
BALL GRID ARRAYS
& COLUMN GRID ARRAYS |
|
COMPONENT REFINISHING |
TIN MITIGATION & GOLD REMOVAL |
|
COMPONENT PREPARATION |
RE-BALLING & LEAD
FORMING |
|
COMPONENT SCREENING |
XRF, DPA, PIND & ELECTRICAL TESTING (MIL-STD-883) |
| COMPONENT LEAD
PITCH |
10
MIL MINIMUM |
| SOLDERING PROCESSES |
LEADED &
LEAD-FREE (ROHS) |
| FLUX
CHEMISTRIES |
RO, RE, OR & IN (NO
CLEAN & WATER SOLUBLE) |
|
ACTIVITY LEVELS |
L0 & L1 (AEROSPACE) AND M0 & H0 (INDUSTRIAL) |
| CLEANING PROCESSES |
AQUEOUS,
CHEMICAL & SAPONIFICATION CLEANING |
|
CLEANLINESS TESTING |
RESISTIVITY OF SOLVENT EXTRACT (ROSE) |
| SPECIAL
PROCESSES |
IONIC
CHROMATOGRAPHY CLEANLINESS TESTING |
| SERIALIZATION |
STANDARD
& CUSTOMER SPECIFIC WITH BAR CODING |
| INVENTORY CONTROL |
DATE & LOT CODE
CONTROL, TWO WAY TRACEABILITY |
|
PRODUCT TESTING |
ELECTRICAL (ICT),
FLYING PROBE
& FUNCTIONAL |
| DEVICE
PROGRAMMING |
AVAILABLE
FOR ALL COMPONENT PACKAGES |
| CONFORMAL COATINGS |
PARYLENE, EPOXY,
ACRYLIC, SILICONE & URETHANE |
| ADHESIVE
APPLICATION |
ENCAPSULATION,
STAKING, UNDERFILL & POTTING |
Our printed circuit board assembly capabilities can provide you
with immediate prototype turnaround and on-time delivery of
production volumes for any single- or double-sided printed
circuit board configuration, including plated through hole,
surface mount and mixed technology on a repeatable zero-defect
production level. We manufacture all printed circuit board
assemblies in strict accordance with the
Acceptability of Electronic Assemblies (IPC A-610) and
the Requirements for Soldered Electrical and Electronic Assemblies
(J-STD-001) specifications, including the space applications
electronic hardware addendum. We maintain
complete lines of assembly, inspection, cleaning and electrical
& functional testing equipment to ensure finished product
conformance to industry specifications and customer
requirements.
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